Broadcom, a leading technology company, showcased the benefits of further developing Co-Packaged Connectivity (CPC) at the recent DesignCon event. Through channel modeling and simulations, Broadcom demonstrated how CPC can reduce signal integrity penalties and extend reach, particularly in data centers crucial for AI applications.
Experimental results showed successful implementation of CPC, addressing bandwidth and signal integrity challenges. A white paper co-authored by Broadcom and Samtec highlighted that CPC allows for the omission of loss and reflection penalties from the printed circuit board and package. This is particularly beneficial as high-speed I/O is cabled from the top of the package, eliminating the need for advanced PCB materials.
As systems scale with an increasing number of I/O and greater reach, CPC presents an opportunity for improved connectivity. Samtec also showcased its Si-FlyHD co-packaged cable assemblies and Samtec FlyoverOctal Small Form-factor Pluggable (OSFP) at OFC. This technology addresses signal integrity and reach limitations by using copper cables to route high-speed signals.
The evaluation platform incorporates Broadcom’s 200G SerDes technology and Samtec’s co-packaged Flyover technology. This enables the industry’s highest footprint density and interconnect robustness, allowing for 102.4T in a chip substrate. Overall, the demonstration highlighted the potential of CPC in addressing critical challenges in data centers and high-speed applications.
Note: The image is for illustrative purposes only and is not the original image associated with the presented article. Due to copyright reasons, we are unable to use the original images. However, you can still enjoy the accurate and up-to-date content and information provided.
